CandCCentral UK - PC Water Cooling, Computer Cooling, And Case Modding

G-1 is an electrically non-conductive thermal adhesive to fix heat sink on CPU / VGA boards. It outperforms other thermal adhesive by a remarkable thermal conductivity and a long-lasting adhesion. G-1 is designed for overclockers and the Accelero TWIN TURBO II and II Plus Accelero Xtreme settled.

Extraordinary Performance

G-1 was developed to the thermal resistance of the RAM / VR to reduce heat sink and to ensure that the heat is dissipated efficiently from the components. The non-metallic property prevents short circuits and provides generous application.

Easy to use

Unlike other thermal greases, aging G-1 when it is not cured. It guarantees a 10-year adhesion. G-1 is available with a stir bar and a container, such that G-1 can be easily mixed together and applied in a desired thickness.

Easy release

After curing is similar to the consistency of a thermal de adhesive mounting pad. The detachment is very simple and leaves no residue.

Technical details:
Thermal Conductivity (W / mk) 4.3
Temperature Range -45 ℃ to 200 ℃
Viscosity (poise) 320
Gravity 2.4 g/cm3 at 25 ℃
Dimensions (Packaging) 90 L x 30 W x 30 H mm
Net Weight 3 sets: 9 g
Model ORACO-TG00201-BL
EAN code 0872767004153
Weight 0.1 kg